2023 4th International Conference on Internet of Things, Artificial Intelligence and Mechanical Automation (IoTAIMA 2023)
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Website http://iotaima.org |
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Deadline: June 26, 2023 | Date: July 21, 2023-July 23, 2023
Venue/Country: China
Updated: 2023-05-19 11:03:00 (GMT+9)
Call For Papers - CFP
It's our great pleasure to invite you to join us for the 2023 4th International Conference on Internet of Things, Artificial Intelligence and Mechanical Automation (IoTAIMA 2023)[第四届物联网、人工智能与机械自动化国际学术会议], which will be held on July 21-23, 2023 in Guangzhou, China. IoTAIMA 2023 will provide a communication forum for the international experts and researchers in the field of Internet of Things, Artificial Intelligence and Mechanical Automation to share research achievements, explore solutions to research challenges, encourage international collaborations, and boost development of science and technology.The annually-held IoTAIMA conference aims to gather professors, researchers, scholars and industrial pioneers all over the world to exchange information in Internet of Things, Artificial Intelligence and Mechanical Automation. The conference welcomes educators and researchers all over the world to provide contribution of academic research and scientific frontier. And the organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to IoTAIMA 2023.Organized byWuhan Institute of artificial Intelligence, Peking University, ChinaCo-organized byCentral South University, ChinaCommitteeConference ChairProf. Peng Lv, Vice Dean of Wuhan Institute of artificial Intelligence, Peking UniversityPublication ChairProf. Jinping Liu, Hunan Normal University, ChinaPublication All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings by Journal of Physics: Conference Series(ISSN: 1742-6596), and submitted to EI Compendex, Scopus for indexing.IoTAIMA OverviewIoTAIMA 2020Hangzhou | July 10-12 Journal of Physics: Conference Series, Volume 1605 EI CompendexScopus Index IoTAIMA 2021Hangzhou | May 14-16 Journal of Physics: Conference Series, Volume 1948EI CompendexScopus Index IoTAIMA 2022Online | July 22-24 Journal of Physics: Conference Series, Volume 2365 EI CompendexScopus IndexCall for paper & Submission Guide Authors are invited to submit original unpublished research papers as well as industrial practice papers. Simultaneous submissions to other conferences are not permitted.Topics of interest for submission include, but are not limited to:Internet of ThingsArtificial IntelligenceIntelligent manufacturingMechanical AutomationMechatronicsMore Topics... Submission *Paper Template Download: http://iotaima.org/download
*Submission: Please submit your papers(word+pdf) via Online Submission System: https://www.aischolar.org/attendees/paperSubmit/EFVNFA3
*Attend the conference: If you only need to do a poster presentation or oral presentation but with no submission, please complete the registration before the registration deadline. Online Registration System: https://www.aischolar.org/attendees/toSignUp/EFVNFA3
NOTE:(1) The paper should be original, written in English, not pure review articles, and the full text should be submitted for review.(2) Authors can check the duplicates at their own expense through the two duplicate checking websites, CrossCheck or Turnitin, and the duplication rate shall not be higher than 30%.(3) The thesis should be formatted according to the template, with no less than 4 pages.(4) Contributing authors can attend the conference for free. Please go to the registration system to register for the conference after registration.RegistrationRegular Registration for Paper (5-6 pages): 490 USD/ paper, 3400 CNY/ paperExtra Pages (Begin at Page 7): 40 USD/ extra page, 300 CNY/ extra pageAttendees without a Submission: 200 USD/ person, 1200 CNY/ personContact usEmail: iotaima
163.comConference Secretary Ms. CenQQ: 239198338Tel/WeChat: +86-13432066330
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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