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ICICM 2024 - 9th International Conference on Integrated Circuits and Microsystems (ICICM 2024)
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Website http://icicm.net/ |
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Category Integrated Circuits and Microsystems
Deadline: September 15, 2024 | Date: October 25, 2024-October 27, 2024
Venue/Country: Wuhan, China
Updated: 2024-09-18 10:44:12 (GMT+9)
Call For Papers - CFP
★Full Name: 2024 The 9th International Conference on Integrated Circuits and Microsystems★Abbreviation: ICICM 2024**Place: Wuhan, China**Time: October 25-27, 2024**Website: http://icicm.net/
=Publication=The accepted and registered papers will be publication in Conference Proceedings, included in IEEE Xplore, which will be indexed by EI Compendex, Scopus, etc.***ICICM 2016-2023 has been successfully indexed by EI Compendex and Scopus already!==History==ICICM2016 | Chengdu on November 23-25, 2016ICICM2017 | Nanjing on November 8-11, 2017ICICM2018 | Shanghai on November 24-26, 2018ICICM2019 | Beijing on October 25-27,2019ICICM2020 | Nanjing on October 23-25, 2020ICICM2021 | Nanjing on October 22-24, 2021ICICM2022 | Xi'an on October 28-31, 2022ICICM2023 | Nanjing on October 20-23, 2023★Co-Sponsored by==Southeast University, China ==University of Electronic Science and Technology of China, China ==Wuhan University of Technology, China==Submission==1. Full paper (publication and presentation) 2. Abstract (presentation only) Electronic submission system: https://easychair.org/conferences/?conf=icicm2024Email submission: icicm_conf
vip.163.com More detail about submission, please visit at http://icicm.net/submission.html=Topics (include but not limit)=► Devices and Circuits for Wirless System► Application Specific Circuits and Systems for Communication► Digital, Analog, Mixed Signal IC and SOC design technology► Silicon integrated circuits and manufacturing► Low-power, RF devices & circuits► IC Computer-Aided –Design technology, DFM► Silicon/germanium devices and device physics► Interconnect, Low K, High K and other process technologies► Unconventional and nano-electronics► Organic semiconductor devices and technologies ► Compound semiconductor devices and circuits► Displays, sensors and MEMS ► Semiconductor materials and material characterization► Packaging and testing technology ► Solar cell & other devices for new energy sources► Modeling and simulation ► Equipment technology► Reliability ► Displays, sensors and MEMS► Advance memories technologyFor more topics, please visit at: http://icicm.net/call-for-papers.html==Organizing Committee==Advisory ChairsJunfa Mao, Shenzhen University, China Yue Hao, Xidian University, ChinaConference ChairsZhigong Wang, Southeast University, ChinaNing Xu, Wuhan University of Technology, China Conference Co-ChairsYu Wang,Tsinghua University,ChinaLetian Huang, University of Electronic Science and Technology of China, ChinaProgram ChairsJiliang Zhang, Hunan University, China Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, ChinaSheng Chang, Wuhan University, ChinaYingmei Chen, Southeast University, ChinaXiulong Wu, Anhui University, ChinaZhikuang Cai, Nanjing University of Posts and Telecommunications, ChinaZhuo Zou, Fudan University, ChinaJianguo Hu, Sun Yat-sen University , ChinaBei Yu,The Chinese University of Hong Kong, ChinaProgram Co-ChairsJunyong Deng, Xi'an University of Posts & Telecommunications, ChinaJun Xu, Nanjing University, ChinaZhixiong Di, Southwest Jiaotong University, ChinaGuojie Luo, Peking University, ChinaXiaojun Zhai, University of Essex, UKWei Xing, The University of Sheffield, UKProgram CommitteeShi Pu, Wuhan University of Technology , ChinaHaizhi Song, University Of Electronic Science And Technology Of China, ChinaLu Zhu, Sun Yat-sen University, ChinaYouming Zhang, Southeast University, ChinaJianshi Tang, Tsinghua University, ChinaWeiguang Sheng, Shanghai Jiao Tong University, ChinaHao Gao, Austria & Eindhoven University of Technology, The NetherlandYun Fang, Silicon Austria Labs, AustriaJeff Kilby, Auckland University of Technology, New ZealandZhijun Zhou, Southeast University, ChinaXingyuan Tong, Xi`an University Of Posts & Telecommunications, ChinaWei Hu, Northwestern Polytechnical University, ChinaLocal ChairBowen Jia, Wuhan University of Technology , ChinaStudent Program ChairsKeping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, ChinaFanyi Meng, Tianjin University, ChinaStudent Program Committee Li Du, Nanjing University, ChinaLei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, ChinaTiehu Li, Chongqing University of Technology, ChinaMoufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, ChinaMaliang Liu, Xidian University, ChinaMore Organizing Committee list, please visit: https://icicm.net/committee.html=CONTACT US=Ms. Jenny ChowEmail: icicm_confvip.163.com Web: http://icicm.net/Tel: (86)134-0855-5552Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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