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    WSAI 2026 - 7th World Symposium on Artificial Intelligence(WSAI 2026)

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    Website http://wsai.org/ | Want to Edit it Edit Freely

    Category Artificial Intelligence

    Deadline: May 15, 2026 | Date: June 24, 2026-June 26, 2026

    Venue/Country: Jinan, China

    Updated: 2026-01-15 18:32:48 (GMT+9)

    Call For Papers - CFP

    Full Name: 2026 The 7th World Symposium on Artificial Intelligence(WSAI 2026)

    Abbreviation: WSAI 2026

    Official Website: http://wsai.org/

    Date: June 24–26, 2026

    Location: Jinan, China

    Publication

    Accepted papers will be published in the WSAI 2026 Conference Proceedings by IEEE. Post-conference, the proceedings will be submitted for inclusion in IEEE Xplore, Ei Compendex and Scopus for review and indexing.

    Call for Papers

    Topics include but are not limited to:

    Track 1: Robotics & Intelligent Systems

    Track 2: Bioinformatics

    Track 3: Machine Learning & Deep Learning

    Track 4: Natural Language Processing & Generative AI

    Track 5: AI for Computer Systems & Edge Computing

    Track 6: AI for Finance & Autonomous Systems

    For the complete list of topics, please visit: http://wsai.org/cfp.html

    Submission Guidelines

    Language: Only manuscripts written in English are accepted.

    Length: Full papers must be at least 4 pages and formatted according to the conference template.

    Abstract Submission: Abstracts may be submitted for oral presentation only and will not be included in the proceedings.

    Submission Methods (choose one):

    Online Submission System: http://www.zmeeting.org/submission/WSAI2026

    Email Submission: wsai_confatoutlook.com or wsai_confat163.com

    Template and Author Guidelines: http://wsai.org/author.html#sub

    Contact Information

    Conference Secretary: Eileen Wu

    Email: wsai_confatoutlook.com | wsai_confat163.com

    Phone: +86-132-9000-0002


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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