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    EMIE 2025 - IEEE 2025 5th International Conference on Electronic Materials and Information Engineering (EMIE 2025)

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    Website https://ais.cn/u/JjiM3u | Want to Edit it Edit Freely

    Category Electronic Materials;Information Engineering;Materials;communication Engineering;optics

    Deadline: August 31, 2025 | Date: September 12, 2025-September 14, 2025

    Venue/Country: Harbin, China

    Updated: 2025-08-06 18:30:36 (GMT+9)

    Call For Papers - CFP

    IEEE 2025 5th International Conference on Electronic Materials and Information Engineering (EMIE 2025) will be held in Harbin, China from September 12 to 14, 2025.

    Conference Website:https://ais.cn/u/JjiM3u

    ---Call For Papers---

    The topics of interest for submission include, but are not limited to:

    ◕ Electronic materials

    Physical chemistry

    Semiconductor material

    Conductive metals and their alloys

    Electromagnetic shielding material

    Dielectric material

    Piezoelectric and ferroelectric materials

    Magnetic material

    Optoelectronic material

    Integrated circuit

    ◕ Information engineering:

    Electronic science and technology

    Information and communication Engineering

    Optoelectronic information science and technology

    Engineering optics

    Information optics

    Electronic technology

    Photoelectric technology

    Communication technology

    Measurement and control technology

    Computer application technology

    ---Publication---

    All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be submitted to IEEE (ISBN: 979-8-3315-5771-3) for publication, and it will be submitted to IEEE Xplore, EI Compendex and Scopus for indexing.

    ---Important Dates---

    Full Paper Submission Date: August 18, 2025

    Registration Deadline: August 30, 2025

    Final Paper Submission Date: August 30, 2025

    Conference Dates: September 12-14, 2025

    --- Paper Submission---

    Please send the full paper(word+pdf) to Submission System:

    https://ais.cn/u/JjiM3u


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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