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    VANET 2009 - The Sixth ACM International Workshop on VehiculAr Inter-NETworking (VANET 2009)

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    Website http://www.sigmobile.org/workshops/vanet2009/cfp_txt.html | Want to Edit it Edit Freely

    Category VANET 2009

    Deadline: April 06, 2009 | Date: September 30, 2009

    Venue/Country: Beijing, China

    Updated: 2010-06-04 19:32:22 (GMT+9)

    Call For Papers - CFP

    ACM VANET 2009

    Vehicle to Vehicle -- Vehicle to Roadside -- Vehicle to Internet

    The Sixth ACM International Workshop on VehiculAr Inter-NETworking

    In conjunction with ACM MobiCom 2009

    Date: To be announced

    Beijing, China

    Sponsored by ACM SIGMOBILE (approval pending)

    http://www.sigmobile.org/workshops/vanet2009/

    Important Dates (tentative):

    Paper Submission Deadline: April 6th

    Notification of Acceptance: June 19th

    Camera-Ready Deadline: July 15th

    The goal of this workshop is to present and discuss recent advances in the development of vehicular inter-networking (VANET) technologies. Based on short- and medium-range communication as well as on cellular systems, vehicular inter-networking will enable vehicular safety applications (including collision and other safety warnings) as well as non-safety applications (like real-time traffic congestion and routing information, high-speed tolling, mobile infotainment, and many others).

    The creation of high-performance, highly reliable, highly scalable, secure, and privacy-preserving VANET technologies presents an

    extraordinary challenge for the wireless research community. Clearly, the specificity of vehicular inter-networking in terms of mobility behavior, applications scenarios, and application requirements makes VANET research an exciting and demanding application- and purpose-driven sub-discipline of wireless networking.

    Furthermore, VANET present a very active field of research, development, standardization, and field trials. Throughout the world,

    there are many national and international projects in government, industry, and academia devoted to VANET. These include consortia like Vehicle Safety Consortium (US), Car-2-Car Communication Consortium (Europe), and Advanced Safety Vehicle Program (Japan), standardization efforts like IEEE 802.11p (WAVE), and field trials like the large-scale Vehicle Infrastructure Integration Program (VII) in the US.

    Authors are invited to submit papers presenting new research related to the theory or practice of vehicular inter-networking (VANET). All submissions must describe original research, not published or currently under review for another workshop, conference, or journal.

    Areas of interest include, but are not limited to:

    - Channel modeling

    - Modulation and coding

    - Power control and scalability issues

    - Medium access control protocols

    - Multi-channel organization and operation

    - Communication protocol design

    - Safety and non-safety applications

    - Vehicle-to-vehicle/roadside/Internet communication

    - Simulation frameworks

    - Field operational testing

    - Network management

    - Security issues and countermeasures

    - Privacy issues

    Submission Instructions

    All paper submissions will be handled electronically. Papers must be in PDF format, no longer than 10 pages (single- or double-column), in font no smaller than 11 points, and must fit properly on US Letter-sized paper (8.5 inch x 11 inch) with reasonable margins. Submitted papers will be judged based on their quality through a double-blind review process, where the identities of the authors are withheld from the reviewers. Detailed instructions for paper submission will be posted on the VANET 2009 web page at:

    http://www.sigmobile.org/workshops/vanet2009/.

    Organizing Committee

    General Co-Chairs:

    Rajeev Shorey, General Motors Research, India

    Andre Weimerskirch, escrypt Inc., USA

    Technical Program Co-Chairs:

    Daniel Jiang, Mercedes-Benz Research & Development North America,Inc., USA

    Martin Mauve, Heinrich-Heine University in D¨?sseldorf

    Technical Program Committee

    Victor Bahl, Microsoft Research, USA

    Fan Bai, General Motors Research, USA

    Fabian Bustamante, Northwestern University, USA

    Levente Buttyan, Budapest University of Technology and Economics, Hungary

    Eylem Ekici, Ohio State University, USA

    Tamer ElBatt, Lockheed Martin Advanced Technology Center, USA

    Andreas Festag, NEC Europe Ltd, Germany

    Hannes Hartenstein, University of Karlsruhe, Germany

    Yih-Chun Hu, University of Illinois at Urbana-Champaign, USA

    Jean-Pierre Hubaux, EPFL, Switzerland

    Daniel Jiang, Mercedes-Benz Research & Development North America,Inc., USA

    Frank Kargl, Ulm University, Germany

    Timo Kosch, BMW, Germany

    P. R. Kumar, University of Illinois at Urbana-Champaign, USA

    Ken Laberteaux, Toyota Research, USA

    Martin Mauve, Heinrich Heine University D¨?sseldorf, Germany

    Panagiotis(Panos) Papadimitratos, EPFL, Switzerland

    Maxim Raya, EPFL, Switzerland

    Paolo Santi, IIT-CNR, Italy

    Björn Scheuermann, Heinrich Heine University D¨?sseldorf, Germany

    Rajeev Shorey, General Motors Research, India

    Daniel Stancil, Carnegie Mellon University, USA

    Ozan Tonguz, Carnegie Mellon University,USA

    Pravin Varaiya, University of California at Berkeley, USA

    Michele Weigle, Old Dominion University, USA

    Andre Weimerskirch, escrypt Inc., USA

    Publicity and Web Chair:

    Fan Bai, General Motors Research, USA


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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