VANET 2009 - The Sixth ACM International Workshop on VehiculAr Inter-NETworking (VANET 2009)
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Website http://www.sigmobile.org/workshops/vanet2009/cfp_txt.html |
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Category VANET 2009
Deadline: April 06, 2009 | Date: September 30, 2009
Venue/Country: Beijing, China
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
ACM VANET 2009Vehicle to Vehicle -- Vehicle to Roadside -- Vehicle to InternetThe Sixth ACM International Workshop on VehiculAr Inter-NETworkingIn conjunction with ACM MobiCom 2009Date: To be announcedBeijing, ChinaSponsored by ACM SIGMOBILE (approval pending)http://www.sigmobile.org/workshops/vanet2009/Important Dates (tentative):Paper Submission Deadline: April 6thNotification of Acceptance: June 19thCamera-Ready Deadline: July 15thThe goal of this workshop is to present and discuss recent advances in the development of vehicular inter-networking (VANET) technologies. Based on short- and medium-range communication as well as on cellular systems, vehicular inter-networking will enable vehicular safety applications (including collision and other safety warnings) as well as non-safety applications (like real-time traffic congestion and routing information, high-speed tolling, mobile infotainment, and many others).The creation of high-performance, highly reliable, highly scalable, secure, and privacy-preserving VANET technologies presents anextraordinary challenge for the wireless research community. Clearly, the specificity of vehicular inter-networking in terms of mobility behavior, applications scenarios, and application requirements makes VANET research an exciting and demanding application- and purpose-driven sub-discipline of wireless networking.Furthermore, VANET present a very active field of research, development, standardization, and field trials. Throughout the world,there are many national and international projects in government, industry, and academia devoted to VANET. These include consortia like Vehicle Safety Consortium (US), Car-2-Car Communication Consortium (Europe), and Advanced Safety Vehicle Program (Japan), standardization efforts like IEEE 802.11p (WAVE), and field trials like the large-scale Vehicle Infrastructure Integration Program (VII) in the US.Authors are invited to submit papers presenting new research related to the theory or practice of vehicular inter-networking (VANET). All submissions must describe original research, not published or currently under review for another workshop, conference, or journal.Areas of interest include, but are not limited to:- Channel modeling- Modulation and coding- Power control and scalability issues- Medium access control protocols- Multi-channel organization and operation- Communication protocol design- Safety and non-safety applications- Vehicle-to-vehicle/roadside/Internet communication- Simulation frameworks- Field operational testing- Network management- Security issues and countermeasures- Privacy issues Submission InstructionsAll paper submissions will be handled electronically. Papers must be in PDF format, no longer than 10 pages (single- or double-column), in font no smaller than 11 points, and must fit properly on US Letter-sized paper (8.5 inch x 11 inch) with reasonable margins. Submitted papers will be judged based on their quality through a double-blind review process, where the identities of the authors are withheld from the reviewers. Detailed instructions for paper submission will be posted on the VANET 2009 web page at:http://www.sigmobile.org/workshops/vanet2009/.Organizing CommitteeGeneral Co-Chairs:Rajeev Shorey, General Motors Research, IndiaAndre Weimerskirch, escrypt Inc., USATechnical Program Co-Chairs:Daniel Jiang, Mercedes-Benz Research & Development North America,Inc., USAMartin Mauve, Heinrich-Heine University in D¨?sseldorfTechnical Program CommitteeVictor Bahl, Microsoft Research, USAFan Bai, General Motors Research, USAFabian Bustamante, Northwestern University, USALevente Buttyan, Budapest University of Technology and Economics, HungaryEylem Ekici, Ohio State University, USATamer ElBatt, Lockheed Martin Advanced Technology Center, USAAndreas Festag, NEC Europe Ltd, GermanyHannes Hartenstein, University of Karlsruhe, GermanyYih-Chun Hu, University of Illinois at Urbana-Champaign, USAJean-Pierre Hubaux, EPFL, SwitzerlandDaniel Jiang, Mercedes-Benz Research & Development North America,Inc., USAFrank Kargl, Ulm University, GermanyTimo Kosch, BMW, GermanyP. R. Kumar, University of Illinois at Urbana-Champaign, USAKen Laberteaux, Toyota Research, USAMartin Mauve, Heinrich Heine University D¨?sseldorf, GermanyPanagiotis(Panos) Papadimitratos, EPFL, SwitzerlandMaxim Raya, EPFL, SwitzerlandPaolo Santi, IIT-CNR, ItalyBjörn Scheuermann, Heinrich Heine University D¨?sseldorf, GermanyRajeev Shorey, General Motors Research, IndiaDaniel Stancil, Carnegie Mellon University, USAOzan Tonguz, Carnegie Mellon University,USAPravin Varaiya, University of California at Berkeley, USAMichele Weigle, Old Dominion University, USAAndre Weimerskirch, escrypt Inc., USAPublicity and Web Chair:Fan Bai, General Motors Research, USA
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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