11th International Conference on Emerging Trends in Electrical, Electronics & Instrumentation Engineering (EEI 2026)

Website https://eei2026.org/index | Edit Freely

Category

Deadline: January 31, 2026 | Date: March 30, 2026-March 31, 2026

Venue/Country: Australia

Updated: 2026-01-27 17:52:17 (GMT+9)

Call For Papers - CFP

March 30 ~ 31, 2026, Virtual Conference

https://eei2026.org/index

SCOPE

The 11th International Conference on Emerging Trends in Electrical, Electronics and Instrumentation Engineering (EEI 2026) serves as a premier forum for researchers, academicians, industry professionals, and innovators to exchange knowledge, discuss breakthroughs, and explore emerging trends across the rapidly evolving domains of electrical, electronics, communication, and instrumentation engineering. As emerging technologies rapidly transform the global engineering landscape, EEI 2026 seeks to showcase breakthrough innovations, encourage cross disciplinary collaboration, and advance research that will shape the future of intelligent systems and next generation engineering solutions

Authors are solicited to contribute by submitting high quality articles that illustrate research results, project outcomes, survey studies, and industrial experiences describing significant advances in the following areas, but not limited to.

Topics of interest

Power, Energy and Control Systems

Smart Grids, Microgrids and Distributed Energy Resources

Renewable and Sustainable Energy Technologies

Power System Stability, Protection and Wide Area Monitoring

High Voltage Engineering and Power Quality

Power Electronics, Electric Drives and E Mobility Systems

EV Charging Infrastructure and Grid Integration

Energy Storage Systems and Battery Management

Advanced Control Systems, Intelligent Automation and Robotics Control

Electronics, VLSI, Semiconductors and Emerging Devices

Analog, Mixed Signal and RF Integrated Circuits

Low Power and Energy Efficient Circuit Design

VLSI Design, CAD Tools and Hardware Security

Semiconductor Devices, Materials and Fabrication Technologies

2D Materials, Flexible Electronics and Printed Electronics

3D ICs, Chiplets and Heterogeneous Integration

Spintronics, Neuromorphic Devices and Quantum Devices

Electromagnetic Compatibility (EMC) and Interference Mitigation

Embedded Systems, Cyber Physical Systems and Robotics

Embedded Systems and Real Time Computing

Cyber Physical Systems (CPS) and Safety Critical Engineering

Industrial IoT, Smart Manufacturing and Automation

Edge AI, TinyML and Embedded Machine Learning

Robotics, Autonomous Systems and Human Robot Interaction

UAVs, Drones and Autonomous Navigation

Hardware, Software Co Design for Intelligent Systems

Communication Systems, Networks and Signal Processing

5G/6G Wireless Communication and Beyond

Terahertz Communication, Photonics and Optical Networks

Satellite Communication, Remote Sensing and Space Technologies

Software Defined Networking (SDN) and Network Virtualization

Network Security, Cryptography and Secure Communication

Digital Signal Processing, Audio/Video Processing and Applications

Antenna Design, Massive MIMO and Reconfigurable Intelligent Surfaces

Sensors, Instrumentation and Measurement Technologies

Advanced Sensors, MEMS/NEMS and Actuators

Bio MEMS, Lab on Chip and Microfluidic Systems

Virtual Instrumentation and Smart Measurement Systems

IoT Sensors and Industrial Instrumentation

Environmental, Structural Health and Condition Monitoring

Instrumentation for Harsh Environments (High Temp, Radiation, Deep Sea)

Biomedical Engineering, Bioinformatics and Health Technologiess

Biomedical Instrumentation and Wearable Health Devices

Medical Imaging, Diagnostics and Signal Processing

Bioinformatics and Health Data Analytics from Sensor-Generated Data

Neural Engineering and Brain Computer Interfaces (BCI)

Implantable Devices and Smart Healthcare Systems

Computing, AI, Optimization and Emerging Technologies

Artificial Intelligence, Machine Learning and Deep Learning Applications

AI Hardware Accelerators and In Memory Computing

Quantum Computing and Quantum Communication

Soft Computing, Evolutionary Algorithms and Optimization Techniques

High Performance and Edge Computing for EEI Applications

Blockchain for Smart Grids, IoT Security and Industrial Automation

Digital Twins and System Simulation

Aerospace, Avionics and Space Engineering

Avionics Systems and Flight Control

Space Electronics and Radiation Hardened Design

Satellite Constellations and Inter Satellite Communication

Space Robotics and Autonomous Space Systems

Human Machine Interaction and Intelligent Interfaces

Sensor Driven Interfaces for AR/VR

Haptic Systems and Tactile Feedback Devices

Intelligent Interfaces for Assistive and Industrial Robotics

Multimodal Human Machine Systems

Paper Submission

Authors are invited to submit papers through the conference Submission System by January 31, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of nde conference will be published by International Journal on Cybernetics & Informatics (IJCI) (Confirmed).

Selected papers from BIO 2026, after further revisions, will be published in the special issue of the following journals

International Journal of Soft Computing, Mathematics and Control (IJSCMC)

Circuits and Systems: An International Journal (CSIJ)

Emerging Trends in Electrical, Electronics & Instrumentation Engineering: An international Journal (EEIEJ)

Electrical Engineering: An International Journal (EEIJ)

Important Dates

2nd batch: Submissions after Dec 29, 2025

Submission Deadline : January 31, 2026

Authors Notification : February 14, 2026

Registration & Camera-Ready Paper Due : February 21, 2026

Contact Us

Here’s where you can reach us : eeieei2026.org or eeiconference839gmail.com