AE2CS-26 2026 - 24th BARCELONA World Conference on Advances in Electrical, Electronics, and Computing Systems (AE2CS-26) scheduled on April 20-22, 2026 Barcelona (Spain)

Website https://eaceee.erpub.org/conference/185 | Edit Freely

Category Electrical, Electronics, and Computing Systems

Deadline: April 01, 2026 | Date: April 20, 2026-April 22, 2026

Venue/Country: Barcelona, Spain

Updated: 2025-12-21 20:37:46 (GMT+9)

Call For Papers - CFP

The field of Electrical, Electronics, and Computing Systems is currently defined by the convergence of AI, sustainable energy, and next-generation hardware architectures.

Topics of Interest for Submission include, but are Not Limited to:

1. Electrical Engineering: Power & Energy Systems

As the global energy landscape shifts toward decentralization, research is focusing on the "Smart Grid" and the integration of intermittent renewables.

Smart Grid & Microgrid Technologies

Subtopics: Self-healing grid architectures, DC microgrids for residential buildings, and peer-to-peer (P2P) energy trading using Blockchain.

Renewable Energy Integration

Subtopics: Bifacial solar panel optimization, Concentrated Solar Power (CSP) with thermal storage, and green hydrogen production via high-efficiency electrolyzers.

Electric Vehicle (EV) Infrastructure

Subtopics: Bidirectional charging (Vehicle-to-Grid/V2G), ultra-fast wireless charging systems, and AI-based battery health management.

Advanced Power Electronics

Subtopics: Wide-bandgap (WBG) semiconductors like Gallium Nitride (GaN) and Silicon Carbide (SiC) for high-efficiency converters.

2. Electronics & VLSI Systems

The "More than Moore" era is driving innovation in how chips are packaged and the materials used to build them.

Next-Gen Semiconductor Materials

Subtopics: Graphene and transition metal dichalcogenides (TMDs) for sub-2nm nodes, and organic electronics for flexible, biodegradable devices.

Advanced IC Packaging

Subtopics: Heterogeneous integration (Chiplets), 3D-IC stacking using Through-Silicon Vias (TSVs), and Fan-Out Wafer-Level Packaging (FOWLP).

Hardware for AI (Edge & Cloud)

Subtopics: Neuromorphic chips that mimic brain architecture, Tensor Processing Units (TPUs), and In-Memory Computing (IMC) to reduce data movement latency.

Hardware Security & Trust

Subtopics: Physically Unclonable Functions (PUFs), detection of Hardware Trojans, and side-channel attack mitigation.

3. Computing Systems & AI

Computing is moving away from purely centralized models toward distributed, privacy-preserving, and "agentic" systems.

Edge Computing & IoT

Subtopics: Low-latency 6G edge intelligence, Swarm Robotics coordination, and energy-harvesting sensors for massive IoT deployments.

Advanced AI Paradigms

Subtopics: Explainable AI (XAI) for transparency in healthcare/finance, Federated Learning for decentralized training without sharing private data, and Agentic AI (autonomous agents capable of multi-step reasoning).

Quantum Computing

Subtopics: Quantum error correction, Hybrid Quantum-Classical algorithms (QAOA, VQE), and Quantum Key Distribution (QKD) for post-quantum cryptography.

Cybersecurity & Resilience

Subtopics: Zero Trust Architecture (ZTA), AI-powered real-time threat detection, and Secure Multiparty Computation (SMPC).

4. Communication & Signal Processing

The transition from 5G to 6G is introducing frequencies and speeds that require entirely new signal processing techniques.

Future Wireless Networks (B5G/6G)

Subtopics: Terahertz (THz) communication, Reconfigurable Intelligent Surfaces (RIS), and Integrated Sensing and Communication (ISAC).

Satellite & Space Communications

Subtopics: Low Earth Orbit (LEO) satellite constellations (Starlink/Kuiper), and optical/laser communication for inter-satellite links.

Advanced Signal Processing

Subtopics: Deep Learning-based physical layer optimization, MIMO beamforming using AI, and compressed sensing for high-resolution imaging.