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    SLIP 2012 - International Workshop on System Level Interconnect Prediction (SLIP)

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    Website www.sliponline.org | Want to Edit it Edit Freely

    Category SLIP 2012

    Deadline: March 05, 2012 | Date: June 03, 2012

    Venue/Country: San Francisco, U.S.A

    Updated: 2012-02-03 15:10:51 (GMT+9)

    Call For Papers - CFP

    The 14th International Workshop of System Level Interconnect Prediction (SLIP) will be co-located with the 49th IEEE/ACM Design Automation Conference on June 3, 2012 at the Moscone Center, San Francisco, California. The general technical scope of the workshop is the design, analysis and prediction of interconnect and communication fabrics in electronic systems. The organizing committee invites original contributions to the workshop. These contributions include papers, tutorials, panels, and special sessions. Regular papers will be double blind reviewed. Submissions with author information will be rejected. We accept papers based on novelty and contributions. The accepted papers will be published in the proceedings of SLIP 2012, which will also be included in the ACM Digital Library. Note that ACM will hold the copyright for SLIP 2012 proceedings. Authors of accepted papers must sign an ACM copyright release form for their papers.

    Representative technical topics include, but are not limited to:

    1. Interconnect prediction and optimization at various IC design stages

    2. Interconnect design challenges and system-level NoC design

    3. Design and analysis of power and clock networks

    4. Interconnect architecture of structural designs and FPGAs

    5. Interconnect fabrics of many-core architectures

    6. Design-for-manufacturing (DFM) techniques for interconnects

    7. High speed chip-to-chip interconnect design

    8. Design and analysis of chip-package interfaces

    9. Interconnect topologies of multiprocessor systems

    10. 3D interconnect design and prediction, including TSV architecture and monolithic 3D stacking

    11. Emerging interconnect technologies, e.g., RF interconnects, photonic networks, carbon-based interconnects, etc.

    12. Synergies between chip communication networks and networks arising in other contexts such as social networks, system biology, etc.

    Workshop themes:

    Keynotes

    Regular paper sessions

    Paper discussion panels

    Interactive poster sessions

    Panels on hot research topics

    Embedded tutorials and invited talks

    Important dates:

    Abstract Registration Due: Feb. 27, 2012

    Submission Deadline: Mar. 5, 2012

    Notification Due: Apr. 6, 2012

    Final Version Due: Apr. 23, 2012

    Authors are invited to submit papers of up to 8 pages, double-columned, 9pt or 10pt font in ACM proceedings format (http://www.acm.org/sigs/publications/proceedings-templates). The papers should be in the PDF format. Authors should submit papers electronically at the following link: https://www.easychair.org/conferences/?conf=slip2012.

    More details about SLIP 2012, including submission guidelines, travel information, and registration can be found online at: www.SLIPonline.org


    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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