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    CMMEA 2011 - 2011 International Workshop on Computational Mechanics, Materials and Engineering Applications

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    Website http://www.iasht.org/cmmea/ | Want to Edit it Edit Freely

    Category Computational Mechanics;Materials;Engineering Applications

    Deadline: May 30, 2011 | Date: July 23, 2011-July 24, 2011

    Venue/Country: Kunming, China

    Updated: 2011-02-07 19:39:31 (GMT+9)

    Call For Papers - CFP

    The 2011 International Workshop on Computational Mechanics, Materials and Engineering Applications (CMMEA 2011) will be held from July 23~24, 2011 in Kunming, P.R. China. The conference will continue the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of Computational Mechanics, Materials and Engineering Applications to meet and present their latest activities. You are cordially invited to attend this interesting event.

    This conference is co-sponsored by Kunming University of Science and Technology and the International Association for Scientific and High Technology, and is in cooperation with Yunnan University, Chongqing Jiaotong University and T.Y. Lin International Engineering Consulting (China) Co., Ltd.

    All accepted papers will be published by the Applied Mechanics and Materials (ISSN: 1660-9336, Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.).

    Selected excellent papers will be published by the special issues for the following Journals:

    International Journal of Materials and Product Technology(IJMPT, SCIE,SciSearch)

    Advanced Science Letters(ASL, SCIE,SciSearch)

    Materials and Manufacturing Processes(MMP, SCIE,SciSearch)

    Topics of Conference

    Area 1 Computational Mechanics and Engineering Applications

    1. Aerodynamics

    2. Acoustics and electromagnetics

    3. Application of numerical methods to engineering problems

    4. Artificial intelligence

    5. Biomechanics, biomaterials and biomedical engineering

    6. Computational biology

    7. Damage and fracture mechanics

    8. Data and signal processing

    9. Environmental science

    10. Fluid mechanics

    11. Fluid-structure interaction

    12. Geomechanics, oil-reservoirs and hydraulics

    13. Graphics and Visualization

    14. Heat and mass transfer

    15. Inverse problems and optimization

    16. Material science and smart materials

    17. Mesh generation and geometrical modelling

    18. Manufacturing processes

    19. Micro and nano-mechanics

    20. Multi-scale mechanics

    21. Non-linear dynamics

    22. Numerical algorithms and numerical methods

    23. Parallel computing

    24. Polymers and composites

    25. Programming techniques and high performance computing

    26. Solid and structural mechanics

    27. Free-surface-modelling

    28. Heat and mass transfer through porous materials

    29. Reactor modelling

    Area 2 Materials Science and Engineering Applications

    1. Materials behavior

    2. Casting and solidification

    3. Powder metallurgy and ceramic forming

    4. Surface, subsurface, and interface phenomena

    5. Coatings and surface engineering

    6. Composite materials

    7. Materials forming

    8. Machining

    9. Nanomaterials and nanomanufacturing

    10. Biomedical manufacturing

    11. Environmentally sustainable manufacturing processes and systems

    12. Manufacturing process planning and scheduling

    13. Meso/micro manufacturing equipment and processes

    14. Modeling, analysis, and simulation of manufacturing processes

    15. Computer-aided design, manufacturing, and engineering

    16. Semiconductor materials manufacturing

    17. Laser based manufacturing

    18. Precision molding processes

    19. Joining processes

    20. Rapid manufacturing technologies

    21. Nontraditional manufacturing

    22. Nanofabrication, nanometrology and applications

    23. Metrology and measurement

    Important Date

    Submission Due: Before May 30, 2011

    Notification of Acceptance: Before June 15, 2011

    REGISTRATION Due: Before June 30, 2011

    Conference Date: July 23-24, 2011

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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