CMS 2011 - 2011 International Conference on Computational Materials Science (CMS 2011)
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Category CMS 2011
Deadline: February 28, 2011 | Date: April 17, 2011-April 18, 2011
Venue/Country: Guangzhou, China
Updated: 2011-02-09 12:31:37 (GMT+9)
Call For Papers - CFP
2011 International Conference on Computational Materials Science (CMS 2011, EI Compendex)2011年?算材料科学学?研?会(CMS 2011, EI?索)Guangzhou, China, April 17-18, 2011 中国?广州,2011年4月17-18日Conference Web site: http://www.ier-institute.org/cms2011/index.htm
The goal of CMS 2011 is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Computational Materials Science, Mechanical, Industrial, and Manufacturing Engineering. We are pleased to invite authors to submit their papers to CMS 2011, addressing issues that serve present and future development of the field. All accepted papers will be included in CMS 2011 Proceedings. All accepted papers will be published by Advanced Materials Research (ISSN: 1022-6680), which will be indexed by EI Compendex.2011年?算材料科学学?研?会(CMS 2011)将于2011年4月17-18日在中国广州召?,会?文集将在TTP出版社(http://www.ttp.net/
)的期刊AMR(Advanced Materials Research, ISSN: 1022-6680)上出版,所有?用的文章都将被EI?索。【SUBMISSION】Submission Mail: cms2011reg
163.com (doc file or pdf file)Submission System: http://www.ieee-ett.cn/cmssub/openconf.php
(pdf file only not exceed 1 MB)è Please do not submit both Mail and system. ?不要同?在系?和?件里投稿,以免重?文章?号。?箱投稿一般24小?内回??号,??。è Please only submit English paper.本次会??接收英文稿件。è Paper Format is in the attachment. 格式模板?附件。è Submission due截稿??:February 28, 2011(2011年2月28日)Act Now! Don't wait until the last minute.【CONTACT】è Email: cms2011reg
163.comè Tel: +86 (0)2787608186; +86 18802716680【TOPICS】Topics of interest for submission include, but are not limited to:l Manufacturing Engineeringl Aerospace Engineeringl Aerospace Systems and Technologyl Aeronautical Engineeringl Computational Fluid Dynamicsl Industrial Engineeringl Mechanical Engineeringl Design and Manufacturingl Life Cycle Design of Productsl Design for Environmentl Design for Manufacturing and Assemblyl Concurrent Engineeringl PDM, PLM, Collaborative Product Design & Commercel Condition Monitoring and Vibration Analysisl Reliability Engineeringl Industrial Tribologyl Applications of AI Techniques in Design and Manufacturingl Modeling & Optimization of Systems and Processesl Automation and Roboticsl Non-Traditional Manufacturingl Advanced Metal Forming,Welding & Casting techniquesl Agile & Lean Manufacturingl Logistics and SCMl CAD/CAM/FMS/CIMSl Reverse Engineering, RP/RTl Micro-Machining, Nano- Technology & Smart Materialsl Mechatronics, MEMS, NEMSl Thermal Engineeringl Computational Heat and Mass Transferl Internal Combustion Enginesl Alternate fuelsl Advanced Refrigeration and Air Conditioningl Turbo Machines and Fluid Power Engineeringl Renewable and Non conventional Energy Sources, Energy Systemsl Cryogenicsl Computational Methods in Thermal Engineeringl Optimization Methods, CFDl Case Studies【REGISTRATION】è Authors (Non Member)一般作者注册 460 USD /2600 RMBè Authors (Student or Member)学生或会?注册 400 USD /2400 RMBè Additional Page (Up to 6 extra pages)超??(6?以上) 70 USD /350 RMB Per Pageè Extra Proceeding ?外?文集?本 200 USD / 1200 RMB Per bookè Additional Paper(s) 相同第一作者,第二、三篇?文?篇版面?(无?文集) 300 USD /1800 RMB Per Paperè Listeners陪同人? 200 USD / 1200 RMB Per Person è Invited Speaker 特邀?告 Free Notes:* One regular registration can cover a paper within 6 pages, including all figures, tables, and references.** One regular registration includes proceeding (published by TTP), tuition, meals and drink (but not hotel room and transport).*** One regular registration with one or more additional papers has only one proceeding book.
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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