TSP-09 2009 - 2009 IEEE International Symposium on Trust, Security and Privacy for Pervasive Applications (IEEE TSP-09)
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Website http://trust.csu.edu.cn/conference/tsp2009/ |
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Category TSP-09 2009
Deadline: May 31, 2009 | Date: October 12, 2009
Venue/Country: Macau, Macau
Updated: 2010-06-04 19:32:22 (GMT+9)
Call For Papers - CFP
2009 IEEE International Symposium on Trust, Security and Privacy for Pervasive Applications (IEEE TSP-09)NEW DATE ---> October 12, 2009 <--- NEW DATEOrganizer: Trusted Computing Institute, Central South University, ChinaMacau SAR, China, October 5-7, 2009http://trust.csu.edu.cn/conference/tsp2009/
To be held in conjunction withThe 2009 IEEE International Conference on Mobile Ad-hoc and Sensor Systems (IEEE MASS 2009)http://www.cs.cityu.edu.hk/mass09/
IntroductionPervasive Computing (or ubiquitous computing) is a rapidly developing research area cross various disciplines including computer science, electronic engineering, mobile and wireless communications, etc. The growing availability of microprocessors with built-in communications facilities makes it possible for people to obtain information and services anytime and anywhere. Pervasive computing could have a range of applications such as healthcare, homecare, intelligent transportation, and environmental monitoring. However, it is quite difficult for pervasive applications to satisfy trust, security and privacy requirements, as a result of their ability to gather sensitive data and change the environment via actuating devices autonomously.Following the success of TSP 2008 in Shanghai, China during December 17-20, 2008, the 2009 IEEE International Symposium on Trust, Security and Privacy for Pervasive Applications (TSP-09) will be held in Macau SAR, China during October 5-7, 2009, in conjunction with The 2009 IEEE International Conference on Mobile Ad-hoc and Sensor Systems (IEEE MASS 2009), aims at bringing together researchers and practitioners in the world working on trust, security, privacy, and related issues such as technical, social and cultural implications for pervasive devices, services, networks, applications and systems, and providing a forum for them to present and discuss emerging ideas and trends in this highly challenging research area.Scope and InterestsTSP-09 is an international forum for presenting and discussing emerging ideas and trends in trust, security and privacy for pervasive applications from both the research community as well as the industry. Topics of interest include, but are not limited to:(1) Trust, Security and Privacy (TSP) metrics and architectures for pervasive computing(2) Trust management in pervasive environment(3) Risk management in pervasive environment(4) Security and privacy protection in pervasive environment(5) Security and privacy in mobile and wireless communications(6) Security and privacy for databases in pervasive environment(7) Safety and user experiences in pervasive environment(8) TSP-aware social and cultural implications in pervasive environment(9) Cryptographic devices for pervasive computing(10) Biometric authentication for pervasive devices(11) Security for embedded software and systems(12) TSP-aware middleware design for pervasive services(13) TSP-aware case studies on pervasive applications/systems(14) Key management in pervasive applications/systems(15) Authentication in pervasive applications/systems(16) Audit and accountability in pervasive applications/systems(17) Access control in pervasive applications/systems(18) Anonymity in pervasive applications/systems(19) Reliability and fault tolerance in pervasive applications/systems(20) Miscellaneous issues in pervasive devices, services, applications, and systemsSubmission and Publication InformationThe accepted papers from this symposium will be published by IEEE Computer Society in IEEE MASS-09 symposium/workshop proceedings (indexed by EI Compendex and ISTP). Papers should be written in English conforming to the IEEE standard conference format (8.5" x 11", Two-Column) [http://www.computer.org/portal/pages/cscps/cps/cps_forms.html
]. Papers should be submitted through the paper submission system at the symposium website [http://trust.csu.edu.cn/conference/tsp2009/submission
]. Each paper is limited to 6 pages (or 8 pages with over length charge). Distinguished papers, after further revisions, will be published in a special issue of The Journal of Supercomputing (Springer) to be indexed by SCI (pending). The program committee will select one winner for the Best Paper Award for this symposium. Submitting a paper to the symposium means that, if the paper is accepted, at least one author should attend the symposium and present the paper. For no-show authors, their papers will be removed from the digital library after the symposium and their affiliations will be notified.FYI: Based on the papers published in TSP-2008 proceedings, we have successfully applied for a Special Issue in IEICE Transactions on Information and Systems (http://www.ieice.org/eng/s_issue/cfp/2010_3ED.pdf
). In this year, based on our TSP-2009 papers, we plan to publish a Special Issue in The Journal of Supercomputing (Springer). Hope to get your contributions in TSP-2009! Thank you very much in advance!Important Dates(1) Paper submission due: May 31, 2009(2) Notification of decision: June 30, 2009(3) Camera-ready papers due: July 31, 2009General Co-ChairsJie Li, University of Tsukuba, JapanGeyong Min, University of Bradford, UKProgram Co-ChairsGuojun Wang, Central South University, ChinaWanlei Zhou, Deakin University, AustraliaProgram Committee (in alphabetical order)Abdallah Mhamed, ITSudParis, FranceAdnan Noor Mian, Sapienza, University of Rome, ItalyAtsushi Inoie, Kanagawa Institute of Technology, JapanBaoliu Ye, Nanjing University, ChinaBhavani Thuraisingham, University of Texas, USAChang-Ai Sun, Beijing Jiao Tong University, ChinaCho-Li Wang, The University of Hong Kong, Hong KongDan Wang, Hong Kong Polytechnic University, Hong KongDhiah el Diehn I. Abou-Tair, University of siegen, GermanyDuminda Wijesekera, George Mason University, USAEduardo Fernandez-Medina, Universidad de Castilla-La ManchaElisa Bertino, Purdue University, USAFang Qi, Central South University, ChinaGang Pan, Zhejiang University, ChinaGregorio Martinez, University of Murcia (UMU), SpainGuilin Wang, University of Birmingham, UKHai Jiang, Arkansas State University, USAHao Yin, Tsinghua University, ChinaHiroshi Mineno, Shizuoka University, JapanImed Romdhani, Npier University, UKIndrajit Ray, Colorado State University, USAIndrakshi Ray, Colorado State University, USAIs-Haka Mkwawa, University of Plymouth, UKJames Joshi, University of Pittsburgh, USAJamie Graves, Napier University, UKJason Crampton, Royal Holloway, University of London, UKGang Peng, Stony Brook University, USAJianming Fu, Wuhan University, ChinaJoon S. Park, Syracuse University, USAJunzhao Du, Xidian University, ChinaKenichi Takahashi, Institute of Systems, Information Technologies and Nanotechnologies, JapanKeqiu Li, Dalian University of Technology, ChinaKouichi Sakurai, Kyushu University, JapanKun Yang, University of Essex, UKLizhe Wang, Rochester Institute of TechnologyLuis Javier Garc??a Villalba, Complutense University of Madrid, SpainMartin Olivier, University of Pretoria, South AfricaMumtaz Kamala, University of Bradford, UKMuneer Bani Yassein, Jordan University of Science and Technology, JordanPrashant Pillai, University of Bradford, UKRobert C. H. Hsu, Chung Hua University, TaiwanRobert H. Deng, Singapore Management University, SingaporeSaad Bani Mohammad, University of Al al-Bayt, JordanSalima Benbernou, University Claude Bernard Lyon1, FranceSanglu Lu, Nanjing University, ChinaSanjay Madria, Missouri University of Science and Technology, USASheika Iqbal Ahamed, Marquette University, USAShiguo Lian, France Telecom R&D (Orange Labs) Beijing, ChinaShui Yu, Deakin University, AustraliaSong Guo, The University of Aizu, JapanSong Han, Curtin University of Technology, AustraliaSteve Barker, King's College, London, UKSugang Xu, NICT, JapanTai-hoon Kim, Hannam University, KoreaThomas Grill, Johannes Kepler University Linz, AustriaTraian Marius Truta, Northern Kentucky University, USAVijayalakshmi Atluri, Rutgers University, USAW. Buchanan, Napier University, UKWei Peng, National University of Defense Technology, ChinaWilly Susilo, University of Wollongong, AustraliaXiaolong Jin, University of Bradford, UKYang Xiang, Central Queensland University, AustraliaYanjiang Yang, I2R, SingaporeYi Mu, University of Wollongong, AustraliaYongdong Wu, Institute for Infocomm Research, SingaporeYoshitaka Nakamura, NARA Institute of Science and Technology, JapanZhe Tang, Central South University, ChinaZhen Chen, Tsinghua University, ChinaZhenjiang Miao, Beijing Jiao Tong University, ChinaZhiwen Yu, Northwestern Polytechnical University, ChinaZonghua Zhang, NICT, JapanSteering Co-ChairsLaurence T. Yang, St. Francis Xavier University, CanadaJianhua Ma, Hosei University, JapanPublicity Co-ChairsAhmed Y. Al-Dubai, Napier University, UKMamun Abu-tair, Queen's University Belfast, UKPeter Mueller, IBM Zurich Research Laboratory, SwitzerlandRuidong Li, National Institute of Information and Communications Technology (NICT), JapanSecretariatYueming Deng, Central South University, China ContactPlease email inquiries concerning TSP-09 to: Prof. Guojun WangEmail csgjwang AT gmail DOT com Homepage http://trust.csu.edu.cn/faculty/~csgjwang/
Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
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