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      EPEPS 2015 -IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

      Send this CFP to us by mail: cfp@ourglocal.org

      Introduction: EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-speed designs, covering:

      Emerging and advanced issues,

      New design techniques and innovative architectures for design and management,

      Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,

      with emphasis on:

      System-level, board-level and on-chip interconnects

      High-speed channels, links, backplanes, serial and parallel interconnects, SerDes

      Multiconductor transmission lines

      Memory and DDR interfaces

      Jitter and noise management

      Signal and thermal integrity

      Power integrity and power distribution networks (PDNs)

      Electronic packages and microsystems

      3D interconnects, 3D packages, TSVs and MCMs

      Nano interconnects and nano structures

      RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches

      Package-chip co-design

      Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows

      Macromodeling including model order reduction as it applies to electrical analysis

      Advanced and parallel CAD techniques for signal, power and thermal integrity analysis

      Measurement and data analysis techniques for system-level and on-chip structures.

      Deadline: Not Wiki | Date: Not Wiki

      Place/Country: Not Wiki/Not Wiki

    1. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2027
    2. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2026
    3. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2025
    4. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2024
    5. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2023
    6. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2022
    7. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2021
    8. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2020
    9. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2019
    10. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2018
    11. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2017
    12. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2016
    13. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2015
    14. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2014
    15. 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS
    16. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2012
    17. 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS
    18. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2010
    19. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2009
    20. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2008
    21. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2007
    22. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2006
    23. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2005
    24. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2004
    25. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2003
    26. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2002
    27. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2001
    28. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 2000
    29. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1999
    30. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1998
    31. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1997
    32. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1996
    33. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1995
    34. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1994
    35. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1993
    36. IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - EPEPS 1992

    Keywords: Accepted papers list. Acceptance Rate. EI Compendex. Engineering Index. ISTP index. ISI index. Impact Factor.
    Disclaimer: ourGlocal is an open academical resource system, which anyone can edit or update. Usually, journal information updated by us, journal managers or others. So the information is old or wrong now. Specially, impact factor is changing every year. Even it was correct when updated, it may have been changed now. So please go to Thomson Reuters to confirm latest value about Journal impact factor.